Nguồn gốc:
Trung Quốc
Hàng hiệu:
WINNER
Chứng nhận:
ISO9100
Số mô hình:
PW-12
As cost pressures in the semiconductor industry continue to increase and advanced packaging requirements become more demanding, material selection is undergoing a structural shift.
Pure gold wire is gradually losing its mainstream position due to its high and volatile raw material cost.
Bare copper wire presents higher oxidation risks, which can negatively impact bonding stability and long-term reliability.
Under these market conditions, Palladium Coated Copper (PCC) wire has emerged as the optimal balance between cost efficiency and reliability performance.
Today, leading global semiconductor packaging companies widely adopt Pd-coated copper wire as their primary bonding material, especially in applications requiring high reliability, fine pitch capability, and stable intermetallic performance.
In integrated circuit (IC) packaging, PCC wire serves as a replacement for traditional gold wire and is widely used in:
QFN / QFP / SOP packages
LED packaging
Power semiconductor packaging
Automotive-grade chip packaging
Compared with conventional gold bonding wire, PCC offers:
Significantly reduced material cost
Higher mechanical strength
Excellent electromigration resistance
Palladium layer effectively suppresses oxidation and improves storage stability
Current mainstream packaging structures include AuPdCu and highly stable PdCu design configurations.
In the electrical interconnection between LED chips and lead frames, PCC wire provides:
Excellent electrical conductivity
High thermal stability
Reliable performance under long-term high-temperature operation
In mid-to-high-end lighting and automotive LED applications, PCC has gradually replaced pure gold wire solutions.
PCC wire is widely applied in:
IGBT modules
MOSFET devices
Automotive-grade MCUs
New energy electric drive modules
The palladium coating effectively reduces interface embrittlement caused by copper oxidation and maintains stable performance under high-temperature and high-humidity environments (e.g., 85°C / 85% RH testing).
In the new energy vehicle power module sector—such as modules integrated into supply chains serving companies like Tesla—bonding materials must meet extremely high durability standards. PCC wire is increasingly becoming one of the preferred materials in this field.
As chips continue to evolve toward:
Smaller pitch
Higher I/O density
Thinner package profiles
Ultra-fine PCC wire (15–25 μm) has become the mainstream choice, particularly suitable for:
AI chip packaging
5G communication chips
High-performance computing (HPC) applications
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